Discrepancy between documentation and layout on CuPillar

[RTimothyEdwards]

The copper pillar device layout in the sg13g2_pr.gds library shows a pillar ID layer that is a circle with radius 45um. Inside this is a passivation cut layer that is 25um wide.

By contrast, the DRC documentation SG13G2_os_layout_rules.pdf has rule Padc.a indicating that the minimum passivation opening is 35um.

My reading of the documentation and illustrations suggests that the CuPillar identification layer is intended to be coincident with the passivation opening, based on the illustration Figure 6.11, where dimension "a" (Padc.a) is marked as "CuPillarPad". From that documentation, I conclude that the CuPillarPad should be 45um diameter (as drawn), but that the passivation cut should also be 45um diameter, and there should be TopMetal2 surrounding CuPillarPad by an overlap distance of at least 7.5um (Padc.c), and that according to the Grid Rules (documentation section 3.1), the TopMetal2 underneath cannot be a circle (must be limited to 45 or 90 degree angles).