Detailed electronics

[mariajmz]

New geometry to have a more detailed description of the elements inside the FEC of the radiopure electronics. We will launch a simulation to see if there's a difference between simulating the events uniformly in the FEC/limande and this situation.

Here you can see the dimensions and the elements that I have included:

For the FEC I chose a 2.5 mm thickness copper foil, for the flat cables 1.0 mm and copper and for the chip and the components, 1.0 mm and silicon as material.

Some questions:

• Are there any dimensions that should be corrected because they are very different? (In particular the thickness)
• Should I model the material for the FEC and limandes as kapton+copper (one foil of kapton and other of copper)?

[juanangp]

• Are there any dimensions that should be corrected because they are very different? (In particular the thickness)
  Not sure about the dimensions, please ask Juan, I think that to use 1mm for the flat cables is very thick, should be around 0.5 mm or so, but please ask Juan. Also ask Juan about the thickness of the Cu foil.

• Should I model the material for the FEC and limandes as kapton+copper (one foil of kapton and other of copper)?
  Yes, pleas, I think half kapton and half Cu should be fine.

[ccogollos]

• The thickness of the components ranges from 0.45mm to 1mm, I would consider assuming a common value of 1mm to be more than enough, and the variations between sizes negligible.
• Regarding density (material) for the limandes I'm not sure, but to be consistent I think the best would be to use the same copper+kapton mixture Susana used in Geant4 for the measurements at Canfranc (this should be at the limandes activity report in confluence).
• For the components I would assume silicon for all of them in order to simplify things. If one checks Susana's measurements in that case densities vary from silicon (2.32 g/cm^3) to TiO2 (4.2 g/cm^3), so silicon would be the best one for being in the safe side neglecting extra self-shielding. On top of that, for FEC simulations when changing material density among Cu, Si, Al, etc. I did not find almost any change on components self-shielding. Which I guess it's to be expected for such small sized volumes.

[JorgeMarquesGarcia]

Based on Eduardo's design files and conversations with the manufacturer, there are some changes in dimensions and thickness. Please see the following images to review the modifications I have made. I have also included the manufacturer's table of layers, which may be useful for the material model

[mariajmz]

Many thanks @juanangp @ccogollos and @JorgeMarquesGarcia for the comments! I will include all the changes as soon as possible in the model and update this PR