Skip to content

polyu-kyfung/lammps-nanocutting-SiC_template_smooth-v-groove-defect-tool_EA.tersoff_lmp20161117

Repository files navigation

An MD study of the wear of defective tools in the nanometric cutting process

Introduction

An MD simulation analysis was conducted to compare the cutting response and the tool wear between flawed and flawless tool surfaces based on a three-layer nanometric cutting model.


Methodology

Materials

  • single diamond tool, with dimensions 11[100] 11[010] 22[001] in x, y, and z directions, edge radius = 4 x diamond unit cell
  • 3C-SiC workpiece, with dimensions 65[010] 15[010] 18[001] in x, y, and z directions

Cutting Conditions

  • Depth of cut = 5 x 3C-SiC unit cell length
  • Cutting direction = [010]<-1 0 0> for ≈200 Å
  • Initial temperature = 300 K

Simultion Settings

  1. Equilibration
  • NVT ensemble, timestep = 0.001 ps (1 fs) for 24000 steps
  1. Cutting
  • NVT+NVE ensembles, timestep = 0.0005 ps (0.5 fs) for 133000 steps

Execution

Input Template:

  • in.cutsic_eq.lmp

Potential

  • EA Scr === pair_style atomistica BrennerScr

Variables

  • v cutting velocity (unit = Å/ps)
  • grooveDepth Depth of V-shaped groove defect on the diamond flank face (Range: [0-9], unit = length of a diamond unit cell)
  • grooveTan Angle of V-shaped groove defect on the diamond flank face in tangent (e.g. input 1 for 45 degrees, 0.5 for 26.56(5) degrees)

example:

@Precision > mpirun -np 32 ../../lmp_mpi_20161117_atomistica046 < in.cutsic_eq.lmp -v v 3.0 -v grooveDepth 0 -v grooveTan 1.0

Citations and References